Research
Multiscale engineering for mechanically intelligent systems
We develop engineered systems that connect mechanics, materials, computation, and automation across micro/nano devices, structural interfaces, open hardware, and mechanically intelligent assemblies.
Structural interfaces
Mechanically Intelligent Structures & Interlocking Systems
We study interlocking systems, compliant structures, geometric nonlinearity, and reusable attachment methods for heterogeneous integration, frame assembly, panelized systems, and mechanically robust interfaces.
Automation + open tools
Open Hardware & Research Automation
We develop experimental platforms, open-source tools, and process-control systems for coating engineering, sample handling, gas adsorption measurement, automated laboratory workflows, and reproducible experimental methods.
Modeling + data
Computation, Modeling & Data-Driven Experimentation
We combine mechanics modeling, computational tools, image analysis, and automated experiments to connect measurements with predictive design and accelerate engineering insight.
Research approach
Connecting mechanics, materials, computation, and automation
Our research is organized around a practical idea: better engineered systems emerge when physical mechanisms, material behavior, experimental measurement, and computational tools are designed together rather than treated as separate activities.
Current project directions include reusable interlocking and attachment systems, automated experimental apparatus, open research tools, and model-informed experimentation.
Projects in the group often combine hands-on experimental development with computational modeling, custom apparatus, open-source software, and iterative design. This creates research opportunities for students who want to move between theory, fabrication, measurement, and system-level engineering.
Interested in working with us?
We welcome inquiries from prospective graduate students, motivated undergraduates, collaborators, and partners interested in multiscale systems, applied mechanics, open hardware, research automation, and mechanically intelligent structures.